封裝/外殼:--
Packing Type:WAFER SAWN
Technology:OptiMOS? 3
Budgetary Price ?€/1k:1.83
VGS(th) min max:2.3 V 3.8 V
Mode:Enhancement
VDS:75 V
RDS (on):1.2m?
Die Size (-) min max:4.5 mm2 6.7 mm2
Die Size (Y):6.7 mm
Die Size (X):4.5 mm
Thickness:175
Die Size (Area):30.15 mm2
EAS/Avalanche Energy:40.0 mJ
無鉛情況/RoHs:無鉛/符合RoHs