封裝/外殼:--
Packing Type:WAFER SAWN
Technology:OptiMOS? 3
Budgetary Price ?€/1k:2.45
Mode:Enhancement
VGS(th) min max:2.0V 4.0V
VDS:250 V
RDS (on):16.0m?
Die Size (Y):6.7 mm
Die Size (X):4.5 mm
Thickness:250
Die Size (Area):30.15 mm2
EAS/Avalanche Energy:40.0mJ
無(wú)鉛情況/RoHs:無(wú)鉛/符合RoHs