封裝/外殼:--
Packing Type:WAFER SAWN
Technology:OptiMOS? 2
Mode:Enhancement
VGS(th) min max:2.0V 4.0V
VDS:100 V
RDS (on):3.2m?
Die Size (-) min max:4.36mm2 6.0mm2
Die Size (Y):6 mm
Die Size (X):4.36 mm
Thickness:250
Die Size (Area):26.16 mm2
EAS/Avalanche Energy:125.0mJ
無鉛情況/RoHs:無鉛/符合RoHs