封裝/外殼:--
Packing Type:WAFER SAWN
Technology:OptiMOS? 3
VGS(th) min max:2.0 V 4.0 V
Mode:Enhancement
VDS:250 V
RDS (on):146.0m?
Die Size (-) min max:1.8 mm2 2.5 mm2
Die Size (Y):2.5 mm
Die Size (X):1.8 mm
Thickness:250
Die Size (Area):4.5 mm2
EAS/Avalanche Energy:120.0mJ
無鉛情況/RoHs:無鉛/符合RoHs